HIP2100EIBZT
vs
LM5100BMAX
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
QFN, SOIC
|
|
| Package Description |
HLSOP, SOP8,.25
|
SOP, SOP8,.25
|
| Pin Count |
16, 8
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
4.89 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Peak Current Limit-Nom |
2 A
|
2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLSOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.68 mm
|
1.75 mm
|
| Supply Voltage-Max |
14 V
|
14 V
|
| Supply Voltage-Min |
9 V
|
9 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Turn-off Time |
0.045 µs
|
0.045 µs
|
| Turn-on Time |
0.045 µs
|
0.045 µs
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
|
|
|
Compare HIP2100EIBZT with alternatives
Compare LM5100BMAX with alternatives