HIP2101IB vs HIP2101EIB feature comparison

HIP2101IB Intersil Corporation

Buy Now Datasheet

HIP2101EIB Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP RENESAS ELECTRONICS CORP
Part Package Code DFN, QFN, SOIC SOICN-EP
Package Description SOP, SOP8,.25 HLSOP,
Pin Count 12, 16, 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
High Side Driver YES YES
Interface IC Type HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0
Length 4.9 mm 4.89 mm
Moisture Sensitivity Level 1 2
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Peak Current Limit-Nom 2 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HLSOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1.68 mm
Supply Voltage-Max 14 V 14 V
Supply Voltage-Min 9 V 9 V
Supply Voltage-Nom 12 V 12 V
Surface Mount YES YES
Technology CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Turn-off Time 0.056 µs 0.056 µs
Turn-on Time 0.056 µs 0.056 µs
Width 3.9 mm 3.9 mm
Base Number Matches 4 3
Pbfree Code No
Manufacturer Package Code M8.15C
Date Of Intro 2017-10-27
Samacsys Manufacturer Renesas Electronics
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare HIP2101EIB with alternatives