HIP4086ABZ-T13
vs
HIP4086AB
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Package Description |
,
|
SOIC-24
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
3
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
9
|
| Part Package Code |
|
PDIP, SOIC
|
| Pin Count |
|
24, 24
|
| Additional Feature |
|
JUNCTION TEMPERATURE FOR TEST
|
| High Side Driver |
|
YES
|
| Input Characteristics |
|
STANDARD
|
| JESD-30 Code |
|
R-PDSO-G24
|
| Number of Functions |
|
3
|
| Number of Terminals |
|
24
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
|
TOTEM-POLE
|
| Output Peak Current Limit-Nom |
|
1.7 A
|
| Output Polarity |
|
TRUE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Technology |
|
MOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
| Turn-off Time |
|
0.1 µs
|
| Turn-on Time |
|
0.1 µs
|
|
|
|
Compare HIP4086ABZ-T13 with alternatives
Compare HIP4086AB with alternatives