HM66AEB18205BP-30 vs CXK77N36R160GB-3 feature comparison

HM66AEB18205BP-30 Renesas Electronics Corporation

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CXK77N36R160GB-3 Sony Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP SONY CORP
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 BGA, BGA119,7X17,50
Pin Count 165 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 1.5 ns
Clock Frequency-Max (fCLK) 333 MHz 333 MHz
I/O Type SEPARATE COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e1 e0
Length 17 mm 22 mm
Memory Density 37748736 bit 18874368 bit
Memory IC Type DDR SRAM LATE-WRITE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 2097152 words 524288 words
Number of Words Code 2000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 2MX18 512KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40 BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.46 mm 2.4 mm
Standby Current-Max 0.35 A 0.16 A
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.9 mA 0.55 mA
Supply Voltage-Max (Vsup) 1.9 V 2.63 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Additional Feature IT CAN ALSO OPERATE WITH 2.5V NOMINAL SUPPLY

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