HM66AEB18205BP-30 vs CY7C1386FV25-250BGI feature comparison

HM66AEB18205BP-30 Renesas Electronics Corporation

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CY7C1386FV25-250BGI Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
Pin Count 165 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 2.6 ns
Clock Frequency-Max (fCLK) 333 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e1 e0
Length 17 mm 22 mm
Memory Density 37748736 bit 18874368 bit
Memory IC Type DDR SRAM CACHE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 2097152 words 524288 words
Number of Words Code 2000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX18 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.46 mm 2.4 mm
Standby Current-Max 0.35 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.9 mA
Supply Voltage-Max (Vsup) 1.9 V 2.625 V
Supply Voltage-Min (Vsup) 1.7 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 14 mm
Base Number Matches 1 1
Rohs Code No
Additional Feature PIPELINED ARCHITECTURE

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