HM66WP18101BP-75
vs
MCM69R738CZP5R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
119
119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
2.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
Length
22 mm
22 mm
Memory Density
18874368 bit
4718592 bit
Memory IC Type
ZBT SRAM
LATE-WRITE SRAM
Memory Width
18
36
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
1048576 words
131072 words
Number of Words Code
1000000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX18
128KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.35 mm
2.4 mm
Supply Voltage-Max (Vsup)
2.625 V
3.465 V
Supply Voltage-Min (Vsup)
2.375 V
3.135 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
BICMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
2
4
Compare HM66WP18101BP-75 with alternatives
Compare MCM69R738CZP5R with alternatives