HM66WP18101BP-75 vs MCM69R738CZP5R feature comparison

HM66WP18101BP-75 Hitachi Ltd

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MCM69R738CZP5R Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 119 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.5 ns 2.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 22 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type ZBT SRAM LATE-WRITE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 1048576 words 131072 words
Number of Words Code 1000000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 2.4 mm
Supply Voltage-Max (Vsup) 2.625 V 3.465 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 4

Compare HM66WP18101BP-75 with alternatives

Compare MCM69R738CZP5R with alternatives