HM66WP18101BP-75 vs MT55V1MV18PT-6 feature comparison

HM66WP18101BP-75 Hitachi Ltd

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MT55V1MV18PT-6 Micron Technology Inc

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD MICRON TECHNOLOGY INC
Part Package Code BGA QFP
Package Description BGA, PLASTIC, TQFP-100
Pin Count 119 100
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.5 ns 3.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PQFP-G100
Length 22 mm 20 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 1.6 mm
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 2 2
Rohs Code No
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63X.87
Standby Current-Max 0.03 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.25 mA
Terminal Finish Tin/Lead (Sn/Pb)

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