HMC830LP6GE
vs
CC1050PWR
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HVQCCN,
|
TSSOP, TSSOP24,.25
|
| Pin Count |
40
|
24
|
| Manufacturer Package Code |
HCP-40-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
5A991.G
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
Texas Instruments
|
| JESD-30 Code |
S-PQCC-N40
|
R-PDSO-G24
|
| JESD-609 Code |
e3
|
e4
|
| Length |
6 mm
|
7.8 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
1.2 mm
|
| Supply Voltage-Nom |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
6 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP24,.25
|
| Technology |
|
CMOS
|
|
|
|
Compare HMC830LP6GE with alternatives
Compare CC1050PWR with alternatives