HSDL-3602-007
vs
HSDL-3602-007
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
LITE-ON TECHNOLOGY CORP
|
| Part Package Code |
MODULE
|
MODULE
|
| Package Description |
,
|
12.2 X 4.9 MM, 4 MM HEIGHT, MODULE-10
|
| Pin Count |
10
|
10
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
R-XSMA-N10
|
R-XSMA-N10
|
| JESD-609 Code |
e0
|
e3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare HSDL-3602-007 with alternatives
Compare HSDL-3602-007 with alternatives