HSDL-7000
vs
HSDL-7002
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
BROADCOM LTD
|
| Package Description |
SOP,
|
HVQCCN,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQCC-N16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
5.6 mm
|
4 mm
|
| Base Number Matches |
5
|
4
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Avago Technologies
|
| Length |
|
4 mm
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
LCC16,.16SQ,25
|
| Peak Reflow Temperature (Cel) |
|
255
|
| Seated Height-Max |
|
0.84 mm
|
|
|
|