HSTL16918DGG
vs
BH16273DL
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
SSOP
|
| Package Description |
TSSOP, TSSOP48,.3,20
|
SSOP,
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HSTL
|
ABT
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| JESD-609 Code |
e4
|
|
| Length |
12.5 mm
|
15.875 mm
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
9
|
8
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Equivalence Code |
TSSOP48,.3,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
5.2 ns
|
3 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
2.8 mm
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
| Width |
6.1 mm
|
7.5 mm
|
| Base Number Matches |
6
|
2
|
| Additional Feature |
|
BUS HOLD INPUTS ELIMINATE THE NEED FOR EXTERNAL PULLUP RESISTORS
|
| Technology |
|
BICMOS
|
| fmax-Min |
|
240 MHz
|
|
|
|
Compare HSTL16918DGG with alternatives
Compare BH16273DL with alternatives