HT66F0172 vs PIC16F689T-I/SO feature comparison

HT66F0172 Holtek Semiconductor Inc

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PIC16F689T-I/SO Microchip Technology Inc

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Part Life Cycle Code Not Recommended Active
Ihs Manufacturer HOLTEK SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
Length 8.66 mm 12.8 mm
Number of I/O Lines 18 18
Number of Terminals 20 20
PWM Channels YES YES
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Speed 20 MHz 20 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Package Description 7.50 MM, PLASTIC, SOIC-20
Pin Count 20
ECCN Code EAR99
Factory Lead Time 4 Weeks
Samacsys Manufacturer Microchip
Additional Feature ALSO OPERATES AT 2V SUPPLY AT 8 MHZ
Boundary Scan NO
CPU Family PIC16
Format FIXED POINT
Integrated Cache NO
JESD-30 Code R-PDSO-G20
JESD-609 Code e3
Low Power Mode YES
Moisture Sensitivity Level 1
Number of External Interrupts 2
Number of Serial I/Os 1
Number of Timers 2
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Equivalence Code SOP20,.4
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 256
ROM (words) 7168
ROM Programmability FLASH
Screening Level AEC-Q100; TS 16949
Seated Height-Max 2.65 mm
Supply Current-Max 5.45 mA
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

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