HV5522PG-G
vs
HV5622PJ-C-G
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
10 X 10 MM, 2.45 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, MO-112AA-2, QFP-44
|
QCCJ,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Data Input Mode |
SERIAL
|
SERIAL
|
| Display Mode |
DOT MATRIX
|
|
| Interface IC Type |
EL DISPLAY DRIVER
|
EL DISPLAY DRIVER
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQCC-J44
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
16.586 mm
|
| Multiplexed Display Capability |
NO
|
|
| Number of Functions |
1
|
1
|
| Number of Segments |
32
|
34
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QCCJ
|
| Package Equivalence Code |
QFP44,.52SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
2.35 mm
|
4.572 mm
|
| Supply Current-Max |
15 mA
|
|
| Supply Voltage-Max |
13.2 V
|
13.2 V
|
| Supply Voltage-Min |
10.8 V
|
10.8 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HVCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
16.586 mm
|
| fmax-Min |
8 MHz
|
4 MHz
|
| Base Number Matches |
2
|
1
|
| Supply Voltage1-Max |
|
230 V
|
|
|
|
Compare HV5522PG-G with alternatives
Compare HV5622PJ-C-G with alternatives