HVCB2010FDC10M0
vs
HVCB2010FHC10M0
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STACKPOLE ELECTRONICS INC
|
STACKPOLE ELECTRONICS INC
|
| Package Description |
SMT, 2010
|
CHIP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8533.21.00.30
|
|
| Factory Lead Time |
13 Weeks
|
13 Weeks
|
| Samacsys Manufacturer |
Stackpole Electronics, Inc.
|
Stackpole Electronics, Inc.
|
| Construction |
Rectangular
|
|
| JESD-609 Code |
e3
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.76 mm
|
0.76 mm
|
| Package Length |
5.08 mm
|
5.08 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.54 mm
|
2.54 mm
|
| Packing Method |
TR, PLASTIC, 7 INCH
|
TR
|
| Rated Power Dissipation (P) |
1 W
|
1 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistance |
10000000 Ω
|
10000000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2010
|
2010
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
50 ppm/°C
|
50 ppm/°C
|
| Terminal Finish |
MATTE TIN OVER NICKEL
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
2000 V
|
2000 V
|
| Base Number Matches |
1
|
1
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
|
|
|
Compare HVCB2010FDC10M0 with alternatives
Compare HVCB2010FHC10M0 with alternatives