HY62U8200BLLST-I-85 vs HY62U8200LST-85 feature comparison

HY62U8200BLLST-I-85 SK Hynix Inc

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HY62U8200LST-85 SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC SK HYNIX INC
Part Package Code TSOP1 TSOP1
Package Description TSOP1, TSOP1,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 85 ns 85 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e6 e6
Length 11.8 mm 11.8 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN BISMUTH TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 8 mm 8 mm
Base Number Matches 1 2

Compare HY62U8200BLLST-I-85 with alternatives

Compare HY62U8200LST-85 with alternatives