I1790EYIR vs I1740XYIR01 feature comparison

I1790EYIR Winbond Electronics Corp

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I1740XYIR01 Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code TSOP DIE
Package Description TSOP1, DIE,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 X-XUUC-N
JESD-609 Code e3
Length 11.8 mm
Number of Functions 1 1
Number of Terminals 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSOP1 DIE
Package Equivalence Code TSSOP28,.53,22
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE, THIN PROFILE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 180 s 80 s
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.55 mm
Terminal Position DUAL UPPER
Width 8 mm
Base Number Matches 1 1

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Compare I1740XYIR01 with alternatives