IBM25PPC405GPR3DB266Z
vs
PPC405GPR3JB266Z
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
IBM MICROELECTRONICS
|
APPLIED MICRO CIRCUITS CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA456,26X26,40
|
35 X 35 MM, LEAD FREE, PLASTIC, EBGA-456
|
| Pin Count |
456
|
456
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66.66 MHz
|
66.66 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
| Length |
27 mm
|
35 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
456
|
456
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA456,26X26,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.21 mm
|
2.65 mm
|
| Speed |
266 MHz
|
266.66 MHz
|
| Supply Voltage-Max |
1.9 V
|
1.9 V
|
| Supply Voltage-Min |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare IBM25PPC405GPR3DB266Z with alternatives
Compare PPC405GPR3JB266Z with alternatives