IBM25PPC750CXEFP10-3T vs 79RC32H434266BCI feature comparison

IBM25PPC750CXEFP10-3T IBM

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79RC32H434266BCI Integrated Device Technology Inc

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer IBM MICROELECTRONICS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description HLBGA, LBGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 64 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 125 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 24.13 mm 17 mm
Low Power Mode YES NO
Number of Terminals 256 256
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HLBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.539 mm 1.7 mm
Speed 600 MHz 266 MHz
Supply Voltage-Max 1.9 V 1.3 V
Supply Voltage-Min 1.7 V 1.1 V
Supply Voltage-Nom 1.8 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 24.13 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 225
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 20

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