ICM7555ID/DG,112 vs MC1455BDR2 feature comparison

ICM7555ID/DG,112 NXP Semiconductors

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MC1455BDR2 Motorola Mobility LLC

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 8 8
Manufacturer Package Code SOT96-1
Reach Compliance Code unknown unknown
Analog IC - Other Type PULSE PULSE
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Frequency-Max 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 3
ECCN Code EAR99
HTS Code 8542.39.00.01
Qualification Status Not Qualified
Supply Current-Max (Isup) 15 mA

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