ICM7555ID/T3 vs ICM7555ID/01,112 feature comparison

ICM7555ID/T3 NXP Semiconductors

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ICM7555ID/01,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description LSOP, SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE PULSE
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e4
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Frequency-Max 0.5 MHz 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.68 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT96-1
Samacsys Manufacturer NXP
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare ICM7555ID/T3 with alternatives

Compare ICM7555ID/01,112 with alternatives