IDB30E60
vs
DSEP29-06AS
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
IXYS CORP
|
| Part Package Code |
TO-220
|
D2PAK
|
| Package Description |
R-PSSO-G2
|
PLASTIC PACKAGE-2
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
Infineon
|
|
| Application |
FAST RECOVERY
|
SOFT RECOVERY
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
2 V
|
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSSO-G2
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
117 A
|
250 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
52.3 A
|
30 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Reverse Recovery Time-Max |
0.126 µs
|
0.035 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
3
|
3
|
| Additional Feature |
|
FREE WHEELING DIODE, SNUBBER DIODE
|
| Case Connection |
|
CATHODE
|
| JEDEC-95 Code |
|
TO-263AB
|
| Power Dissipation-Max |
|
165 W
|
|
|
|