IDT7007S25JI8 vs IDT7007S25GG feature comparison

IDT7007S25JI8 Integrated Device Technology Inc

Buy Now Datasheet

IDT7007S25GG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQCC-J68 S-CPGA-P68
JESD-609 Code e0 e3
Memory Density 262144 bit 262144 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Ports 2 2
Number of Terminals 68 68
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ PGA
Package Equivalence Code LDCC68,1.0SQ PGA68,11X11
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.03 A 0.015 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.345 mA 0.305 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND PIN/PEG
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Time@Peak Reflow Temperature-Max (s) 20
Base Number Matches 1 6
Part Package Code PGA
Package Description PGA, PGA68,11X11
Pin Count 68
Length 29.464 mm
Number of Functions 1
Seated Height-Max 3.683 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 29.464 mm

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