IDT70914S15JI8
vs
70V914S15PF8
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
LCC
|
TQFP
|
| Package Description |
PLASTIC, LCC-68
|
,
|
| Pin Count |
68
|
80
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
15 ns
|
|
| JESD-30 Code |
S-PQCC-J68
|
|
| JESD-609 Code |
e0
|
e0
|
| Length |
24.2062 mm
|
|
| Memory Density |
36864 bit
|
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
9
|
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
|
| Number of Terminals |
68
|
|
| Number of Words |
4096 words
|
|
| Number of Words Code |
4000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
4KX9
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCJ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
225
|
240
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
24.2062 mm
|
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
PN80
|
|
|
|
Compare IDT70914S15JI8 with alternatives
Compare 70V914S15PF8 with alternatives