IDT70914S15JI8 vs IDT70914S15JGI8 feature comparison

IDT70914S15JI8 Integrated Device Technology Inc

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IDT70914S15JGI8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC LCC
Package Description PLASTIC, LCC-68 QCCJ,
Pin Count 68 68
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e0 e3
Length 24.2062 mm 24.2062 mm
Memory Density 36864 bit 36864 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 9 9
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4KX9 4KX9
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 24.2062 mm 24.2062 mm
Base Number Matches 1 1

Compare IDT70914S15JI8 with alternatives

Compare IDT70914S15JGI8 with alternatives