IDT70914S15JI8 vs IDT70914S15PF9 feature comparison

IDT70914S15JI8 Integrated Device Technology Inc

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IDT70914S15PF9 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC QFP
Package Description PLASTIC, LCC-68 TQFP-80
Pin Count 68 80
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
JESD-30 Code S-PQCC-J68 S-PQFP-G80
JESD-609 Code e0 e0
Length 24.2062 mm 14 mm
Memory Density 36864 bit 36864 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 9 9
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 68 80
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4KX9 4KX9
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LQFP
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 24.2062 mm 14 mm
Base Number Matches 1 1
Additional Feature AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; SELF TIMED WRITE
Number of Ports 2
Output Characteristics 3-STATE
Output Enable YES

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