IDT70V05L55GGI vs IDT7005S55PFB feature comparison

IDT70V05L55GGI Integrated Device Technology Inc

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IDT7005S55PFB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PGA QFP
Package Description CERAMIC, PGA-68 LQFP, QFP64,.66SQ,32
Pin Count 68 64
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code S-CPGA-P68 S-PQFP-G64
JESD-609 Code e3 e0
Length 29.464 mm 14 mm
Memory Density 65536 bit 65536 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 68 64
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA LQFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.207 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position PERPENDICULAR QUAD
Width 29.464 mm 14 mm
Base Number Matches 1 1
I/O Type COMMON
Moisture Sensitivity Level 3
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code QFP64,.66SQ,32
Peak Reflow Temperature (Cel) 240
Standby Current-Max 0.03 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.3 mA
Time@Peak Reflow Temperature-Max (s) 30

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