IDT70V05L55PF vs 7005L55FGI8 feature comparison

IDT70V05L55PF Integrated Device Technology Inc

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7005L55FGI8 Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 QFF,
Pin Count 64
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
I/O Type COMMON
JESD-30 Code S-PQFP-G64 S-PQFP-F68
JESD-609 Code e0 e3
Length 14 mm 24.2062 mm
Memory Density 65536 bit 65536 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 64 68
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QFF
Package Equivalence Code QFP64,.66SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Seated Height-Max 1.6 mm 4.572 mm
Standby Current-Max 0.005 A
Standby Voltage-Min 3 V
Supply Current-Max 0.155 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING FLAT
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm 24.2062 mm
Base Number Matches 7 1

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Compare 7005L55FGI8 with alternatives