IDT7164L15J8 vs L7C185HC15 feature comparison

IDT7164L15J8 Integrated Device Technology Inc

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L7C185HC15 LOGIC Devices Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC LOGIC DEVICES INC
Part Package Code QFJ DIP
Package Description PLASTIC, LCC-32 DIP, DIP28,.6
Pin Count 32 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
JESD-30 Code R-PQCC-J32 R-CDIP-T28
JESD-609 Code e0 e0
Length 13.97 mm 35.56 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 32 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.55 mm 4.953 mm
Standby Voltage-Min 2 V 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Base Number Matches 1 1
Additional Feature AUTOMATIC POWER-DOWN
I/O Type COMMON
Moisture Sensitivity Level 3
Package Equivalence Code DIP28,.6
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.00025 A
Supply Current-Max 0.185 mA

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