IDT7165S25TCB vs HM1E-65764K-9:D feature comparison

IDT7165S25TCB Integrated Device Technology Inc

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HM1E-65764K-9:D Temic Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEMIC SEMICONDUCTORS
Part Package Code DIP
Package Description 0.300 INCH, THIN, SIDE BRAZED, DIP-28
Pin Count 28
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 25 ns 35 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T28 R-GDIP-T28
JESD-609 Code e0
Length 35.56 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.19 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 3

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