IDT71V3557SA75BGI8 vs CY7C1345B-50AC feature comparison

IDT71V3557SA75BGI8 Integrated Device Technology Inc

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CY7C1345B-50AC Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA QFP
Package Description 14 X 22 MM, PLASTIC, BGA-119 LQFP,
Pin Count 119 100
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.5 ns 11 ns
Additional Feature FLOW-THROUGH ARCHITECTURE SELF-TIMED WRITE
JESD-30 Code R-PBGA-B119 R-PQFP-G100
JESD-609 Code e0 e0
Length 22 mm 20 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX36 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.36 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code No

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Compare CY7C1345B-50AC with alternatives