IDT71V416S10BEI
vs
CY7C1041CV33-10ZCT
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
TSOP2
|
| Package Description |
9 X 9 MM, BGA-48
|
TSOP2,
|
| Pin Count |
48
|
44
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
10 ns
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-PBGA-B48
|
|
| JESD-609 Code |
e0
|
|
| Length |
9 mm
|
|
| Memory Density |
4194304 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
|
| Memory Width |
16
|
|
| Moisture Sensitivity Level |
4
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
48
|
|
| Number of Words |
262144 words
|
|
| Number of Words Code |
256000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256KX16
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFBGA
|
|
| Package Equivalence Code |
BGA48,6X8,30
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Standby Current-Max |
0.02 A
|
|
| Standby Voltage-Min |
3 V
|
|
| Supply Current-Max |
0.2 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.75 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
9 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare IDT71V416S10BEI with alternatives
Compare CY7C1041CV33-10ZCT with alternatives