IDT79R3051-20MJ vs N80C186EB-13 feature comparison

IDT79R3051-20MJ Integrated Device Technology Inc

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N80C186EB-13 Intel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEL CORP
Part Package Code QFN LCC
Package Description QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature BURST BUS; 5 PIPELINE STAGES
Address Bus Width 32 20
Bit Size 32 16
Boundary Scan NO NO
Clock Frequency-Max 40 MHz 26 MHz
External Data Bus Width 32 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0
Length 29.083 mm 29.3 mm
Low Power Mode NO YES
Moisture Sensitivity Level 1
Number of DMA Channels
Number of External Interrupts 6 6
Number of Serial I/Os 2
Number of Terminals 84 84
On Chip Data RAM Width
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 4.57 mm 4.83 mm
Speed 20 MHz 13 MHz
Supply Current-Max 400 mA 73 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.083 mm 29.3 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 4

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