IDT79R3051-20PH vs IDT79R3041-33J8 feature comparison

IDT79R3051-20PH Integrated Device Technology Inc

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IDT79R3041-33J8 Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC LCC
Package Description QCCJ, LDCC84,1.2SQ CAVITY DOWN, PLASTIC, LCC-84
Pin Count 84 84
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 40 MHz 66.66 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.2862 mm 29.2862 mm
Low Power Mode NO NO
Number of DMA Channels
Number of External Interrupts 6 6
Number of Serial I/Os
Number of Terminals 84 84
On Chip Data RAM Width
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 4.572 mm 4.57 mm
Speed 20 MHz 33 MHz
Supply Current-Max 350 mA 370 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 29.2862 mm 29.2862 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Additional Feature BURST BUS; 5 PIPELINE STAGES
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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