IDT79RC32V364100DAGI
vs
HD6417604SFI28
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
|
FQFP,
|
Pin Count |
144
|
144
|
Reach Compliance Code |
compliant
|
compliant
|
Address Bus Width |
32
|
27
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
NO
|
Clock Frequency-Max |
100 MHz
|
8 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
JESD-609 Code |
e3
|
|
Length |
20 mm
|
20 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
FQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
3.05 mm
|
Speed |
100 MHz
|
28.7 MHz
|
Supply Voltage-Max |
3.465 V
|
5.5 V
|
Supply Voltage-Min |
3.135 V
|
4.5 V
|
Supply Voltage-Nom |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
20 mm
|
20 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
HTS Code |
|
8542.31.00.01
|
Number of External Interrupts |
|
16
|
Package Equivalence Code |
|
QFP144,.87SQ,20
|
Supply Current-Max |
|
160 mA
|
Technology |
|
CMOS
|
|
|
|
Compare IDT79RC32V364100DAGI with alternatives
Compare HD6417604SFI28 with alternatives