IDT79RV5000300BS272
vs
MPC5200CBV266B
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA,
|
BGA, BGA272,20X20,50
|
| Pin Count |
272
|
272
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
64
|
32
|
| Bit Size |
64
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
125 MHz
|
35 MHz
|
| External Data Bus Width |
64
|
32
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
| JESD-609 Code |
e0
|
e0
|
| Length |
29 mm
|
27 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
272
|
272
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.65 mm
|
2.65 mm
|
| Speed |
300 MHz
|
266 MHz
|
| Supply Voltage-Max |
3.465 V
|
1.58 V
|
| Supply Voltage-Min |
3.135 V
|
1.42 V
|
| Supply Voltage-Nom |
3.3 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
29 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
| Package Equivalence Code |
|
BGA272,20X20,50
|
|
|
|
Compare IDT79RV5000300BS272 with alternatives
Compare MPC5200CBV266B with alternatives