IH5045MJE/883B
vs
HI1-5045-7
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
DPST
|
DPST
|
| JESD-30 Code |
R-XDIP-T16
|
R-XDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Normal Position |
NO
|
NO
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| On-state Resistance-Max (Ron) |
150 Ω
|
75 Ω
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
CERAMIC
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Surface Mount |
NO
|
NO
|
| Switch-on Time-Max |
1000 ns
|
1000 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
5
|
4
|
|
|
|
Compare IH5045MJE/883B with alternatives