IN4683CUR-1 vs 1N4685CUR-1 feature comparison

IN4683CUR-1 Microsemi Corporation

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1N4685CUR-1 Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP-LAWRENCE MICROSEMI CORP
Package Description O-LELF-R2 MELF-2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature HIGH RELIABILITY, METALLURGICALLY BONDED HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA DO-213AA
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Reference Voltage-Nom 3 V 3.6 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 0.05 mA 0.05 mA
Base Number Matches 6 15
Rohs Code No

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