IS61DDB24M18A-250M3L vs MT57W4MH8JF-6 feature comparison

IS61DDB24M18A-250M3L Integrated Silicon Solution Inc

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MT57W4MH8JF-6 Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, TBGA,
Pin Count 165 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 28 Weeks
Access Time-Max 0.45 ns 0.5 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 17 mm
Memory Density 75497472 bit 33554432 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 18 8
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX18 4MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.89 V 1.9 V
Supply Voltage-Min (Vsup) 1.71 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm 15 mm
Base Number Matches 2 1
JESD-609 Code e1
Qualification Status Not Qualified
Terminal Finish TIN SILVER COPPER

Compare IS61DDB24M18A-250M3L with alternatives

Compare MT57W4MH8JF-6 with alternatives