IS61DDB251236A-300B4I vs CXK77N36R160GB-3 feature comparison

IS61DDB251236A-300B4I Integrated Silicon Solution Inc

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CXK77N36R160GB-3 Sony Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC SONY CORP
Part Package Code BGA BGA
Package Description LBGA, BGA, BGA119,7X17,50
Pin Count 165 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 1.5 ns
Additional Feature PIPELINED ARCHITECTURE IT CAN ALSO OPERATE WITH 2.5V NOMINAL SUPPLY
JESD-30 Code R-PBGA-B165 R-PBGA-B119
Length 15 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type DDR SRAM LATE-WRITE SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX36 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 1.89 V 2.63 V
Supply Voltage-Min (Vsup) 1.71 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 14 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Qualification Status Not Qualified
Standby Current-Max 0.16 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.55 mA
Terminal Finish TIN LEAD

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