IS61DDB251236A-300B4I
vs
AS7C33128NTD36A-200BC
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
ALLIANCE SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
LBGA,
|
LQFP,
|
| Pin Count |
165
|
100
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
0.45 ns
|
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
|
| JESD-30 Code |
R-PBGA-B165
|
|
| Length |
15 mm
|
|
| Memory Density |
18874368 bit
|
|
| Memory IC Type |
DDR SRAM
|
|
| Memory Width |
36
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
165
|
|
| Number of Words |
524288 words
|
|
| Number of Words Code |
512000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512KX36
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Seated Height-Max |
1.4 mm
|
|
| Supply Voltage-Max (Vsup) |
1.89 V
|
|
| Supply Voltage-Min (Vsup) |
1.71 V
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
13 mm
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
|
|
|
Compare IS61DDB251236A-300B4I with alternatives
Compare AS7C33128NTD36A-200BC with alternatives