IS61DDB251236A-300B4I vs IS61QDPB21M18A-300B4 feature comparison

IS61DDB251236A-300B4I Integrated Silicon Solution Inc

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IS61QDPB21M18A-300B4 Integrated Silicon Solution Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description LBGA, LBGA, BGA165,11X15,40
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type DDR SRAM QDR SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX36 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.89 V 1.89 V
Supply Voltage-Min (Vsup) 1.71 V 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1
Rohs Code No
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Qualification Status Not Qualified
Standby Current-Max 0.28 A
Standby Voltage-Min 1.7 V
Supply Current-Max 1.05 mA

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Compare IS61QDPB21M18A-300B4 with alternatives