IS61LF25618A-7.5B2I
vs
MCM69L738ZP9R
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA, BGA119,7X17,50
|
BGA,
|
| Pin Count |
119
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
7.5 ns
|
|
| Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
|
| Clock Frequency-Max (fCLK) |
117 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PBGA-B119
|
|
| JESD-609 Code |
e0
|
|
| Length |
22 mm
|
|
| Memory Density |
4718592 bit
|
|
| Memory IC Type |
CACHE SRAM
|
|
| Memory Width |
18
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
119
|
|
| Number of Words |
262144 words
|
|
| Number of Words Code |
256000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256KX18
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA119,7X17,50
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.41 mm
|
|
| Standby Current-Max |
0.035 A
|
|
| Standby Voltage-Min |
3.14 V
|
|
| Supply Current-Max |
0.16 mA
|
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
14 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare IS61LF25618A-7.5B2I with alternatives
Compare MCM69L738ZP9R with alternatives