IS61LPS51236B-200TQLI
vs
IS61LPS51236A-200TQLI
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
INTEGRATED SILICON SOLUTION INC
|
| Package Description |
LQFP,
|
LQFP, QFP100,.63X.87
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Factory Lead Time |
10 Weeks
|
10 Weeks
|
| Samacsys Manufacturer |
Integrated Silicon Solution Inc.
|
Integrated Silicon Solution Inc.
|
| Access Time-Max |
3 ns
|
3.1 ns
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| Length |
20 mm
|
20 mm
|
| Memory Density |
18874368 bit
|
18874368 bit
|
| Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
| Memory Width |
36
|
36
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512KX36
|
512KX36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LQFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
10
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
100
|
| Additional Feature |
|
PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
|
200 MHz
|
| I/O Type |
|
COMMON
|
| JESD-609 Code |
|
e3
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
QFP100,.63X.87
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.125 A
|
| Supply Current-Max |
|
0.475 mA
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|