IS61LV10008-10M vs CY14B108L-BA25XIT feature comparison

IS61LV10008-10M Integrated Silicon Solution Inc

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CY14B108L-BA25XIT Cypress Semiconductor

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 9 X 11 MM, MINI, BGA-48 FBGA-48
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 25 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e1
Length 11 mm 10 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM NON-VOLATILE SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.63 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm 6 mm
Base Number Matches 2 1
Package Equivalence Code BGA48,6X8,30
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.01 A
Supply Current-Max 0.075 mA
Time@Peak Reflow Temperature-Max (s) 20

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