IS61NLP51236B-200B3LI vs IS61NLP51236B-200B3L feature comparison

IS61NLP51236B-200B3LI Integrated Silicon Solution Inc

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IS61NLP51236B-200B3L Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TBGA, TBGA,
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 12 Weeks
Access Time-Max 3 ns 3 ns
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX36 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 13 mm 13 mm
Base Number Matches 2 4

Compare IS61NLP51236B-200B3LI with alternatives

Compare IS61NLP51236B-200B3L with alternatives