IS64LF12836A-7.5B3LA3
vs
MCM69L738ZP9R
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
MOTOROLA INC
|
| Package Description |
TBGA, BGA165,11X15,40
|
BGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Factory Lead Time |
10 Weeks
|
|
| Samacsys Manufacturer |
Integrated Silicon Solution Inc.
|
|
| Access Time-Max |
7.5 ns
|
|
| Clock Frequency-Max (fCLK) |
117 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PBGA-B165
|
|
| Length |
15 mm
|
|
| Memory Density |
4718592 bit
|
|
| Memory IC Type |
CACHE SRAM
|
|
| Memory Width |
36
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
165
|
|
| Number of Words |
131072 words
|
|
| Number of Words Code |
128000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX36
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TBGA
|
|
| Package Equivalence Code |
BGA165,11X15,40
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.2 mm
|
|
| Standby Current-Max |
0.045 A
|
|
| Standby Voltage-Min |
3.14 V
|
|
| Supply Current-Max |
0.175 mA
|
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
13 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare IS64LF12836A-7.5B3LA3 with alternatives
Compare MCM69L738ZP9R with alternatives