ISD4003-06MPY vs ISD4003-06MPI feature comparison

ISD4003-06MPY Winbond Electronics Corp

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ISD4003-06MPI Nuvoton Technology Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP NUVOTON TECHNOLOGY CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP,
Pin Count 28 28
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-PDIP-T28
Length 36.83 mm 36.83 mm
Number of Functions 1 1
Number of Terminals 28 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 360 s 360 s
Seated Height-Max 4.83 mm 4.83 mm
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 3 1

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Compare ISD4003-06MPI with alternatives