ISD5116SI vs ISD5116SD feature comparison

ISD5116SI Winbond Electronics Corp

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ISD5116SD Winbond Electronics Corp

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description 0.300 INCH, PLASTIC, SOIC-28 SOP,
Pin Count 28 28
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Application HAND-HELD DEVICES HAND-HELD DEVICES
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e0
Length 17.9 mm 17.9 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 960 s 960 s
Seated Height-Max 2.65 mm 2.65 mm
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 1 1

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