ISL32455EIUZ-T7A
vs
XR3075XED-F
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
EXAR CORP
|
| Part Package Code |
MSOP
|
|
| Package Description |
TSSOP,
|
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
M8.118
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Differential Output |
YES
|
|
| Driver Number of Bits |
1
|
|
| Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
EIA-485; EIA-422
|
|
| JESD-30 Code |
S-PDSO-G8
|
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Out Swing-Min |
1.1 V
|
|
| Output Low Current-Max |
0.005 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Receive Delay-Max |
200 ns
|
|
| Receiver Number of Bits |
1
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Current-Max |
4.5 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transmit Delay-Max |
200 ns
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ISL32455EIUZ-T7A with alternatives
Compare XR3075XED-F with alternatives