ISL43L840IR
vs
ISL43L840IR-T
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
INTERSIL CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
3 X 3 MM, PLASTIC, MO-220-VEED, QFN-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
65 dB
|
65 dB
|
| On-state Resistance Match-Nom |
0.12 Ω
|
0.12 Ω
|
| On-state Resistance-Max (Ron) |
0.75 Ω
|
0.75 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.6 V
|
1.6 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
LCC16,.12SQ,20
|
| Qualification Status |
|
Not Qualified
|
| Switching |
|
BREAK-BEFORE-MAKE
|
|
|
|
Compare ISL43L840IR with alternatives
Compare ISL43L840IR-T with alternatives